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History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft
G. D. Wagner
Modern Electronic Packaging Technology
M. G. Bevan and B. M. Romenesko
Some Key Issues in Microelectronic Packaging
G. V. Clatterbaugh, P. Vichot, and H. K. Charles, Jr.
Miniaturization of Space Electronics with Chip-on-Board Technology
B. Q. Le, E. Nhan, R. H. Maurer, R. E. Jenkins, A. L. Lew, H. S. Feldmesser, and J. R. Lander
Multichip Module Substrated
N. A. Blum, H. K. Charles, Jr., and A. S. Francomacaro
Transmit/Receive Module Packaging: Electrical Design Issues
B. A. Kopp, C. R. Moore, and R. V. Coffman
System-Level Packaging: Putting It All Together
D. S. Mehoke, H. S. Feldmesser, and P. D. Grimm
The Case for Plastic-Encapsulated Microcircuits in Spaceflight Applications
A. F. Moor, A. Casanovas, and S. R. Purwin
APL's Packaging Future: The Next Few Years
H. K. Charles, Jr.
Electronic Packaging Research and Education: A Model for the 21st Century
R. R. Tummula
THE COVER: Electronic packaging is the key to the effective use of electronics in modern systems technology.
For more than half a century, APL has provided innovative electronic packaging solutions for major system development efforts, ranging from the VT fuze to the Near Earth Asteroid Rendezvous spacecraft. The cover illustrates some of our major packaging successes along with renditions of modern integrated circuits. The explosion in density and speed of the integrated circuit is driving worldwide electronic packaging to new levels of miniaturization and performance. (Cover illustration by Kenneth R. Moscati and Lori A. Hartman.)
Inside front cover information: